SUNSHINE SP-50 CPU SOLDERING PASTE

Out Of Stock  SUNSHINE SP-50 CPU SOLDERING PASTE

Description :

1. 158 degree ,Customized for BGA IC welding .

2.?soldering joint bright ,full Wuxi beats , moderate viscosity

3.After welding ,less residue ,appearance ?and transparency ,high insulation resistance .

4.Has good wettability ,excellent welding

 

Name

 SUNSHINE 158 ℃ BGA CPU Solder Paste

Diameter

 28mm

Weight

 50g

Particle size

 20-38um

Conductivity rate

 14

flux content

 9+-0.5

Viscosity

 178+-10

Feature

 low smoke,RoHs solder paste,non-corroding

Melting point

 158 degree

Application

 Mobile CPU

 

Application:

Mobile phone chip repair, computer repair, Home Appliances repair, appliance repair or customized for BGA IC welding

Write a review

Please login or register to review
  • Views: 885
  • Brand: General
  • Product Code: DZD002998
  • Availability: Out Of Stock
  • 1,000.00DA
  • Ex Tax: 1,000.00DA

Tags: sunshine, sp, 50, cpu, soldering, paste